I Just Replaced My Thermal Paste a Few Months Ago and Core Temp Is High Again April 04, 2022 Post a Comment After about a year using the 5700xt I noticed that I was losing FPS. Temps seem fine. But I noticed that the fan speed was ramping upwards a lot college. But temps were still fine. Well, having done this 1000x already I knew I had to re-apply paste just I thought it was odd that I needed to practise so this early. Well, when I opened it up this is what I found: That'southward a 1st! Proverb I needed to re-utilise paste is an understatement. Just if you look closer you lot will see that thermal paste was applied in small dot grid. And I wondered if that causes some of my OC issues from a month agone. Even so, afterwards re-applying thermal chemical compound the fan is at 0 RPM at desktop consistently now. I almost forgot information technology could exercise that. MerolaC Ancient Guru Messages: 3,704 Likes Received: 590 GPU: That is called thermal pump out. The paste becomes liquid similar, like information technology's seen there later it has suffered thermal cycles. Few commercials pastes are usable on for a direct die application. Thermal Grizzly Hydronaut is one of them, which doesn't suffer pump out. Other I've been using for my clients on their laptops is Gelid GC-Extreme. Others will endure pumpout. Watch this vid in full: ZXRaziel and Undying like this. I found changing the paste to Gelid Extreme on any gfx card I owned, fifty-fifty when brand new, can assist a lot. I havent noticed a pump out result on a GPU since using Gelid farthermost paste, I apply information technology very thin. ie my 1080ti FE has an Arctice cooling Extreme Three cooler fitted since new and temps are still as good after 4 years. However the pump out effect still happens on a delidded 6700K CPU core, some cores spring up to 10C departure over time, that I havent solved. Well, didn't know about that pump-out. Guess one never stops learning, and that's a good affair. Gonna repaste all my gear in 2021. New yr resolution already! At present, that's a reason to restock on thermal paste. ZXRaziel Principal Guru Messages: 425 Likes Received: 134 GPU: I accept never seen thermal paste behaving like that , it was ordinarily stale out for me . From physics Signal of view you would think that the liquid should help the estrus transfer, conspicuously there is more to it , would be interesting to know how thermal pastes are formulated and how practise they work in depth . Interesting. MerolaC Aboriginal Guru Messages: 3,704 Likes Received: 590 GPU: More on this if anyone is interested. I did TONS AND TONS of enquiry on this because of my work. MX-2 and four for example are EXTREMLY afflicted past Pumpout. I know because I have tested. The more than silicone they take the more than they pumpout. I always cringe when people say I inverse my GPU paste to MX4. They say: the previous i was dried similar rock. No, that's because that style information technology won't pump out. That's how it comes out of manufacturing plant. Remember the dies on Intel CPUS? That look similar rock? Aye, information technology'due south past design, those pastes last YEARS earlier they actually go bad. This is a myth created to get you to buy more of the crap. The transfer material is the suspended particles in the paste, non the liquid itself. MerolaC Ancient Guru Messages: 3,704 Likes Received: 590 GPU: LOL Myth. Sure, human. If you lot do yous own testing, you lot wouldn't be spouting bullshit like this. What about using a graphite thermal pad? I switched to one for my CPU a while back and it seems to piece of work well enough, just I like the thought of never having to worry almost information technology once it'southward installed (won't dry out or dethrone). I'm thinking near using one with my RX 580 at some point. MerolaC Aboriginal Guru Messages: three,704 Likes Received: 590 GPU: For a die application, don't practise information technology. You need a HIGH amount of pressure to achieve good contact betwixt the die and the heat sink. Stick to paste or LM. Passus Ancient Guru Messages: two,019 Likes Received: 642 GPU: I employ mx-4 on my 5700 and I as well replaced the thermal pads easy 10c reduction on core and around 20c on junction I'grand yet a big fan of ICD-vii. I repasted laptops and never needed to redo it, always. Haven't needed to redo my paste on my 5700XT, but now I'thou curious to lookout man fan speeds. INSTG8R Ancient Guru Messages: 1,659 Likes Received: 95 GPU: I merely automatically tranquility my cards probably within a calendar week of purchase p, I just can't fight the urge. Usually use MX4 just last few I've been using Kryonaught. If anyone is wondering about the thermal pad thickness of the vrm's/mosfet expanse of the Nitro+ information technology looks to exist 1.5mm thick. Already compared OEM pad to 1.5mm ane and looks to be a lucifer. I would recommend Fujiploy Farthermost Ultimate 17 W/mK But from watching the video any liquidie thermal paste should be replaced once a year. Update: On CPU https://********/1sFtbDJ/paste1.jpg https://********/KzmcjpR/paste2.jpg Sorry about the blurriness I did some quick snaps with the phone every bit I had the loop in one hand and phone in the other. But as you can even so run across 100% pump out using thermal grizzly kryonaut. After near 2 years use. CPU temps were fine. . Which is strange to me. I would expect college temps. But I was only get mid 50C running Cinebench. That is what I ever used to determine if I need to reapply paste. At desktop I was around 20C. After re-applying information technology temps were still around 20C at desktop. Naught changed temp wise using kryonaut MerolaC Aboriginal Guru Messages: 3,704 Likes Received: 590 GPU: Thermal pumpout is just a problem on direct die applications, on IHS it won't affair at all. Care to elaborate? I'm curious. The in a higher place video made me think. I am intrigued. I didn't know well-nigh this until at present. MerolaC Ancient Guru Messages: iii,704 Likes Received: 590 GPU: Basically, on a direct die application, the tim stop up squishing out of the dice because of the thermal cycles and high temperatures (hot common cold hot common cold, that causes expansion and contraction of the hetsink) and you end up with poor coverage betwixt the common cold plate and the die. The temperature of the IHS is lower than that of a dice, so, pump out is less likely to happen. anticupidon and Goiur similar this. Only the thickness doesn't make a difference? I am asking considering I bought some Shin Etsu TIM and was a pain to spread. Merely have the best temps always. We are talking 2012 time frame. Lots of brands and lots of improvements since then. Thicker helps but doesnt foreclose it. I used MX4 or something like that on my 6700K delid until I had chosen something better. I think my CPUs lid is not flat on the inside because of how astringent the issue becomes. At commencement all cores were inside a few degrees C of each other after applying new paste, only afterwards a few days some cores were up to 15C higher temp than others. Its always the same cores unless I reverse the lid, and so its dissimilar cores, then I suspect the lid also as the paste. Then with Gelid Extreme paste (very thick) information technology took a few weeks for the same to happen but isnt quite as bad, around x to 12C difference even subsequently a twelvemonth. I really want to go all cores near each other permanently though because it affects the max overclock quite badly. Not that it matters so much now cos I have a 10700K gaming machine. Simply dammit, this shouldnt be rocket science to fix! I really bought one of those Kickstarter direct die water blocks a few years ago that concluded up being severely delayed due to mfr'ing problems and companies non doing as asked. So the guy built his ain CNC auto and they are patently shipping out now, only mine was supposed to be sent a calendar month ago and no give-and-take since then. Its been a strange experience. Terminal edited: Dec 31, 2020 Share This Page bakerunfue1978.blogspot.com Source: https://forums.guru3d.com/threads/re-applying-thermal-paste-works-wonders.435998/ Share Post a Comment for "I Just Replaced My Thermal Paste a Few Months Ago and Core Temp Is High Again"
After about a year using the 5700xt I noticed that I was losing FPS. Temps seem fine. But I noticed that the fan speed was ramping upwards a lot college. But temps were still fine. Well, having done this 1000x already I knew I had to re-apply paste just I thought it was odd that I needed to practise so this early. Well, when I opened it up this is what I found: That'southward a 1st! Proverb I needed to re-utilise paste is an understatement. Just if you look closer you lot will see that thermal paste was applied in small dot grid. And I wondered if that causes some of my OC issues from a month agone. Even so, afterwards re-applying thermal chemical compound the fan is at 0 RPM at desktop consistently now. I almost forgot information technology could exercise that.
That is called thermal pump out. The paste becomes liquid similar, like information technology's seen there later it has suffered thermal cycles. Few commercials pastes are usable on for a direct die application. Thermal Grizzly Hydronaut is one of them, which doesn't suffer pump out. Other I've been using for my clients on their laptops is Gelid GC-Extreme. Others will endure pumpout. Watch this vid in full:
I found changing the paste to Gelid Extreme on any gfx card I owned, fifty-fifty when brand new, can assist a lot. I havent noticed a pump out result on a GPU since using Gelid farthermost paste, I apply information technology very thin. ie my 1080ti FE has an Arctice cooling Extreme Three cooler fitted since new and temps are still as good after 4 years. However the pump out effect still happens on a delidded 6700K CPU core, some cores spring up to 10C departure over time, that I havent solved.
Well, didn't know about that pump-out. Guess one never stops learning, and that's a good affair. Gonna repaste all my gear in 2021. New yr resolution already! At present, that's a reason to restock on thermal paste.
I accept never seen thermal paste behaving like that , it was ordinarily stale out for me . From physics Signal of view you would think that the liquid should help the estrus transfer, conspicuously there is more to it , would be interesting to know how thermal pastes are formulated and how practise they work in depth . Interesting.
More on this if anyone is interested. I did TONS AND TONS of enquiry on this because of my work. MX-2 and four for example are EXTREMLY afflicted past Pumpout. I know because I have tested. The more than silicone they take the more than they pumpout. I always cringe when people say I inverse my GPU paste to MX4. They say: the previous i was dried similar rock. No, that's because that style information technology won't pump out. That's how it comes out of manufacturing plant. Remember the dies on Intel CPUS? That look similar rock? Aye, information technology'due south past design, those pastes last YEARS earlier they actually go bad.
This is a myth created to get you to buy more of the crap. The transfer material is the suspended particles in the paste, non the liquid itself.
LOL Myth. Sure, human. If you lot do yous own testing, you lot wouldn't be spouting bullshit like this.
What about using a graphite thermal pad? I switched to one for my CPU a while back and it seems to piece of work well enough, just I like the thought of never having to worry almost information technology once it'southward installed (won't dry out or dethrone). I'm thinking near using one with my RX 580 at some point.
For a die application, don't practise information technology. You need a HIGH amount of pressure to achieve good contact betwixt the die and the heat sink. Stick to paste or LM.
I employ mx-4 on my 5700 and I as well replaced the thermal pads easy 10c reduction on core and around 20c on junction
I'grand yet a big fan of ICD-vii. I repasted laptops and never needed to redo it, always. Haven't needed to redo my paste on my 5700XT, but now I'thou curious to lookout man fan speeds.
I merely automatically tranquility my cards probably within a calendar week of purchase p, I just can't fight the urge. Usually use MX4 just last few I've been using Kryonaught.
If anyone is wondering about the thermal pad thickness of the vrm's/mosfet expanse of the Nitro+ information technology looks to exist 1.5mm thick. Already compared OEM pad to 1.5mm ane and looks to be a lucifer. I would recommend Fujiploy Farthermost Ultimate 17 W/mK But from watching the video any liquidie thermal paste should be replaced once a year.
Update: On CPU https://********/1sFtbDJ/paste1.jpg https://********/KzmcjpR/paste2.jpg Sorry about the blurriness I did some quick snaps with the phone every bit I had the loop in one hand and phone in the other. But as you can even so run across 100% pump out using thermal grizzly kryonaut. After near 2 years use. CPU temps were fine. . Which is strange to me. I would expect college temps. But I was only get mid 50C running Cinebench. That is what I ever used to determine if I need to reapply paste. At desktop I was around 20C. After re-applying information technology temps were still around 20C at desktop. Naught changed temp wise using kryonaut
Care to elaborate? I'm curious. The in a higher place video made me think. I am intrigued. I didn't know well-nigh this until at present.
Basically, on a direct die application, the tim stop up squishing out of the dice because of the thermal cycles and high temperatures (hot common cold hot common cold, that causes expansion and contraction of the hetsink) and you end up with poor coverage betwixt the common cold plate and the die. The temperature of the IHS is lower than that of a dice, so, pump out is less likely to happen.
Only the thickness doesn't make a difference? I am asking considering I bought some Shin Etsu TIM and was a pain to spread. Merely have the best temps always. We are talking 2012 time frame. Lots of brands and lots of improvements since then.
Thicker helps but doesnt foreclose it. I used MX4 or something like that on my 6700K delid until I had chosen something better. I think my CPUs lid is not flat on the inside because of how astringent the issue becomes. At commencement all cores were inside a few degrees C of each other after applying new paste, only afterwards a few days some cores were up to 15C higher temp than others. Its always the same cores unless I reverse the lid, and so its dissimilar cores, then I suspect the lid also as the paste. Then with Gelid Extreme paste (very thick) information technology took a few weeks for the same to happen but isnt quite as bad, around x to 12C difference even subsequently a twelvemonth. I really want to go all cores near each other permanently though because it affects the max overclock quite badly. Not that it matters so much now cos I have a 10700K gaming machine. Simply dammit, this shouldnt be rocket science to fix! I really bought one of those Kickstarter direct die water blocks a few years ago that concluded up being severely delayed due to mfr'ing problems and companies non doing as asked. So the guy built his ain CNC auto and they are patently shipping out now, only mine was supposed to be sent a calendar month ago and no give-and-take since then. Its been a strange experience.
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